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Rohm introduces a compact high output surface mount LED with lens
2020-02
Semiconductors
Rohm Semiconductor
[Feb 5 2020] Rohm announces the launch of a compact high output surface mount LED equipped with a lens. The new family includes 18 devices, including the CSL0901 series with standard brightness and the high-brightness CSL0902 series. In recent years, most vehicle instrument group designs have adopted shielding structures to prevent LED light leakage. However, due to the expansion caused by temperature changes ...

NXP introduces a new generation of automotive position sensors
2020-02
Semiconductors
NXP
[Feb 4 2020] NXP Semiconductors N.V. introduced a new generation of automotive position sensor KMA210. The KMA210 integrates NXP's latest magnetoresistive sensor chips and a unique signal conditioning ASIC circuit based on NXP's advanced insulated silicon (SOI) ABCD9 process. The KMA210 is the first member of a new family of magnetic sensors and is a complete system-level package solution that requires no ext ...

New wireless soft wearable health monitor
2020-02
Sensors
AKM Semiconductor Inc.
[Feb 4 2020] Researchers have created a wireless wearable health monitor built using stretchable electronics. The researchers believe that the new wearable sensor could allow comfortable, long-term monitoring of adults, infants, and small children without having to worry about skin damage or allergic reactions caused by traditional adhesive sensors. Conventional sensors often tear the delicate skin of childre ...

Murata introduces metal terminal MLCC for wireless power transmission equipment
2020-02
Semiconductors
Murata
[Feb 3 2020] Murata has commercialized the KCM series of multi-layer ceramic capacitors with metal terminals for automotive applications and the KRM series of multi-layer ceramic capacitors with metal terminals for general applications with temperature compensation C0G characteristics. Our main goal is to use it in places such as LC resonant circuits for wireless power transmission (WPT*1) systems for electri ...

Qorvo introduces new intelligent power control solutions
2020-02
Power
Qorvo US Inc.
[Feb 2 2020] Qorvo has introduced a new intelligent power control solution, the Qorvo PAC5556 Power Application Controller (PAC), which significantly reduces the energy consumption, size, weight and noise of smart appliances, AC fans and compressors. This new mixed-signal system-level package (SiP) product not only reduces the bill of materials by 35 percent, but also improves the performance, reliability and ...

TDK introduces the DeltaCap X Black Premium capacitor
2020-02
Passive Components
TDK
[Feb 2 2020] TDK Corporation introduces the DeltaCap X Black Premium capacitor, a new series of EPCOS MKD capacitors developed specifically for power factor correction (PFC). Voltage ratings range from 440 V AC to 850 V AC, and the internal triangular connection design is ideal for low voltage power factor correction and harmonic filtering applications. Cell capacitors range in capacity from 3 x51μF to 3 x165 ...

Semtech unveils new LoRa smart home devices for iot applications
2020-02
Power
Semtech
[Feb 1 2020] Semtech, a leading provider of analog and mixed-signal semiconductor products and advanced algorithms, announced the introduction of a new LoRa Smart Home device (LLCC68d), expanding LoRa's market from industry-class low power wide area networks (LPWAN) to smart home, community and consumer applications. The transceiver provides low power consumption and wide coverage for Internet of Things (IoT) ...

TE introduces new Sliver jumper connectors for OCP NIC 3.0 applications
2020-02
Connectors
TE Connectivity
[Feb 1 2020] TE Connectivity, the global leader in innovative connectivity solutions for high-speed computing and networking applications, announced the introduction of a new Sliver jumper connector that features a new standard form factor and supports panel pluggability for the Open Source Computing Project (OCP) NIC 3.0. This new jumper connector further expands the Sliver product family and is suitable for ...

An ultra-small RX651 32-bit MCU for iot connectivity modules and space-constrained edge devices
2020-01
Power
Renesas Electronics America
[Jan 31 2020] Renesas Electronics has introduced four new 32-bit RX651 microcontrollers (MCUS) in an ultra-small 64-pin BGA and LQFP package. The new product expands Renesas' popular RX651 MCU family with a 64-pin (4.5mm x 4.5mm) BGA package that offers up to 59% less area than the 100-pin LGA; The 64-pin (10mm x 10mm) LQFP has 49% less area than the 100-pin LQFP. This family of MCUS addresses advanced securit ...

New digital analog hybrid integrated software defined radio automotive tuner
2020-01
Connectors
Silicon Labs
[Jan 30 2020] Silicon Labs has introduced a new digital-analog hybrid, all-in-one Software-Defined Radio (SDR) tuner for a leading automotive radio solution provider, expanding its portfolio to support all global digital radio standards on a single common platform to meet the growing needs of automotive radio manufacturers. The new Si479x7 device is Silicon Labs' first automotive Radio tuner to support the Dig ...

STMicroelectronics introduces the 1050V MOSFET VIPer converter with the highest breakdown voltage on the market
2020-01
Connectors
STMicroelectronics
[Jan 29 2020] STMicroelectronics VIPer26K releases a high-voltage power converter that integrates a 1050V avalanch-resistant N-channel power MOSFET to provide the offline power supply with the advantages of wide voltage input and simple design. In SO-16N package. With extremely high voltage ratings, the VIPer26K MOSFETs achieve similar voltage handling capabilities without the need for traditional vertically s ...

Toposens introduces new 3D ultrasonic sensor TS3 to improve detection accuracy of autonomous vehicles
2020-01
Power
Toko
[Jan 28 2020] German company Toposens has introduced its new flagship TS3, a 3D ultrasonic sensor for a variety of applications in the autonomous driving systems market that enables reliable target detection and situational awareness. In contrast to conventional ultrasonic sensors, which are usually only able to measure the distance to the nearest object's reflective surface, Toposens' new 3D sensor has a fiel ...