Technology Articles

2020-02 Connectors Microchip Technology

[Feb 8 2020] Microchip announced its entry into the memory infrastructure market with the industry's first commercial serial memory controller, expanding its data center portfolio. The SMC 1000 8 x 25G enables cpus and other compute-centric SOCs to use quadruple memory channels connected in parallel with DDR4 DRAM in the same package size. Microchip's serial memory controllers not only provide higher memory b ...

2020-02 Connectors Harwin Inc.

[Feb 7 2020] In order to provide customers with simple plug and play solutions, Harwin has now launched a range of off-the-shelf cable assemblies for use with the popular Datamate series of high-reliability connectors. Available in single-ended or double-ended formats with set cable lengths of 150 mm (6 inches), these time-saving components are destined to have considerable market potential. These components ...

2020-02 Semiconductors Renesas Electronics America

[Feb 7 2020] Renesas Electronics Corporation announced the launch of the fourth-generation lithium-ion (Li-ion) battery management IC that offers high accuracy and lifetime. The ISL78714 provides accurate battery voltage and temperature measurements, battery equalization, and extensive system diagnostics to protect 14 lithium battery packs and maximize battery life and range for hybrid and electric vehicles ( ...

2020-02 Semiconductors Xilinx

[Feb 6 2020] Xilinx announced the launch of the Alveo U50, further expanding its Alveo data center accelerator card portfolio. The Alveo U50 card is the industry's first lightweight adaptive compute acceleration card that supports fourth-generation PCIe Gen 4 and is specifically designed to scale a variety of critical compute, network, and storage workloads, all on the same reconfigurable FPGA platform. Alveo ...

2020-02 Semiconductors Toshiba Semiconductor and Storage

[Feb 5 2020] Toshiba has introduced a new design for NVMe SSDS that are small enough to replace soldable BGA SSDS. The new XFMEXPRESS form factor allows for two or four PCIe lanes while taking up much less space than the smallest M.2 22x30mm card size. The XFMEXPRESS card measures 18x14x1.4mm, making it larger and thicker than a microSD card. The floor area is up to 22.2x17.75x2.2mm. In comparison, BGA SSDS c ...

2020-02 Semiconductors Rohm Semiconductor

[Feb 5 2020] Rohm announces the launch of a compact high output surface mount LED equipped with a lens. The new family includes 18 devices, including the CSL0901 series with standard brightness and the high-brightness CSL0902 series. In recent years, most vehicle instrument group designs have adopted shielding structures to prevent LED light leakage. However, due to the expansion caused by temperature changes ...

2020-02 Sensors AKM Semiconductor Inc.

[Feb 4 2020] Researchers have created a wireless wearable health monitor built using stretchable electronics. The researchers believe that the new wearable sensor could allow comfortable, long-term monitoring of adults, infants, and small children without having to worry about skin damage or allergic reactions caused by traditional adhesive sensors. Conventional sensors often tear the delicate skin of childre ...

2020-02 Semiconductors NXP

[Feb 4 2020] NXP Semiconductors N.V. introduced a new generation of automotive position sensor KMA210. The KMA210 integrates NXP's latest magnetoresistive sensor chips and a unique signal conditioning ASIC circuit based on NXP's advanced insulated silicon (SOI) ABCD9 process. The KMA210 is the first member of a new family of magnetic sensors and is a complete system-level package solution that requires no ext ...

2020-02 Semiconductors Murata

[Feb 3 2020] Murata has commercialized the KCM series of multi-layer ceramic capacitors with metal terminals for automotive applications and the KRM series of multi-layer ceramic capacitors with metal terminals for general applications with temperature compensation C0G characteristics. Our main goal is to use it in places such as LC resonant circuits for wireless power transmission (WPT*1) systems for electri ...

2020-02 Power Qorvo US Inc.

[Feb 2 2020] Qorvo has introduced a new intelligent power control solution, the Qorvo PAC5556 Power Application Controller (PAC), which significantly reduces the energy consumption, size, weight and noise of smart appliances, AC fans and compressors. This new mixed-signal system-level package (SiP) product not only reduces the bill of materials by 35 percent, but also improves the performance, reliability and ...

2020-02 Passive Components TDK

[Feb 2 2020] TDK Corporation introduces the DeltaCap X Black Premium capacitor, a new series of EPCOS MKD capacitors developed specifically for power factor correction (PFC). Voltage ratings range from 440 V AC to 850 V AC, and the internal triangular connection design is ideal for low voltage power factor correction and harmonic filtering applications. Cell capacitors range in capacity from 3 x51μF to 3 x165 ...

2020-02 Power Semtech

[Feb 1 2020] Semtech, a leading provider of analog and mixed-signal semiconductor products and advanced algorithms, announced the introduction of a new LoRa Smart Home device (LLCC68d), expanding LoRa's market from industry-class low power wide area networks (LPWAN) to smart home, community and consumer applications. The transceiver provides low power consumption and wide coverage for Internet of Things (IoT) ...