Technology Articles

2020-02 Passive Components Vishay

[Feb 17 2020] Vishay has introduced three new series of X1, X2 and Y2 Electromagnetic interference (EMI) suppression film capacitors -F340X1, F340X2 and F340Y2 - which meet the standards for jumper and bypass circuit applications. The latest series of F340 EMI suppression capacitors meet the most stringent humidity reliability requirements and are certified to IEC 60384-14:2013 ed.4 / AMD1:2016 Level IIIB: "Hi ...

2020-02 Semiconductors Qualcomm

[Feb 17 2020] Qualcomm has unveiled a series of new WiFi chips that support WiFi 6 technology, which the company hopes will boost sales of its 5G chips. Qualcomm is the largest supplier of chips for mobile phones, but the company has been looking to expand into other areas as the global mobile phone market has stalled in recent years. The SAN Diego-based technology company has been pushing into chips for cars, ...

2020-02 Connectors Maxim Integrated

[Feb 16 2020] Maxim Integrated announces the launch of the MAX17301/11 coulometer, an integrated battery protector that provides designers with the highest level of safety protection. The MAX17301 and MAX17311 are the latest solutions in the coulometer family, and the IC is used on the battery pack side to provide the industry's most flexible battery safety configuration and fine-tune voltage and current thres ...

2020-02 Semiconductors Davies Molding, LLC

[Feb 16 2020] Dutch company Drive Technology Holland has developed a globally patented gearless drive system that can help significantly improve the efficiency and performance of (electric) cars, vehicles, boats, wind turbines, bicycles and machines. Drive Technology Holland is headquartered in the Eindhoven region. For more than a decade, the technology company has been continuously developing innovative tech ...

2020-02 Passive Components Xilinx

[Feb 15 2020] Xilinx has officially launched the Virtex UltraScale+ VU19P, the world's largest FPGA. It is reported that the VU19P uses a 16nm process, based on the Arm architecture, with 35 billion transistors, that is, the highest logic density and the largest number of I/ OS ever in a single chip, and can support the simulation and prototyping of the most advanced ASIC and SoC technologies in the future. VU ...

2020-02 Semiconductors STMicroelectronics

[Feb 15 2020] STMicroelectronics new STDRIVE601 three-phase gate driver is used to drive 600V N-channel power MOSFET and IGBT electrode body, stability ranks the most advanced level in the industry, can withstand negative peak voltage as low as -100V, logic input response speed within 85ns, At the same level of product first-class level. The STDRIVE601 has built-in intelligent turn-off circuit, which can impro ...

2020-02 Semiconductors CML Microcircuits

[Feb 14 2020] CML Microcircuits has announced the CMX7146, a flexible data modulator that simplifies the design of transmit-only solutions using BPSK (binary phase-shift keying) and differential BPSK modulation (also known as PRK, phase reversal keying or 2PSK). Powered by a 3.3V single supply, it is delivered in a space-saving 48-pin QFN package. The CMX7146 generates accurate baseband analog in-phase and ort ...

2020-02 Connectors Molex

[Feb 14 2020] Molex introduces D-Sub shape factor ground connectors that will help customers make strong and robust ground connections without the use of specialized tools or training. The connectors are designed for harsh environments and meet the requirements of IP66 and IP67 grades. The ground connector protects the device from stray voltages with a secure, low-impedance ground connection. Connectors with I ...

2020-02 Semiconductors Diodes Incorporated

[Feb 13 2020] Diodes announced the introduction of the AP3917 series of universal AC-DC non-isolated step-down power switchers for a variety of low-power applications, such as small devices powered by off-line power and Internet of Things endpoints. The series includes AP3917B (170mA rated load), AP3917C (270mA) and AP3917D (370mA). The AP3917BS7-13 comes in a surface-adhesive SO-7 package and is available in ...

2020-02 Semiconductors Vishay

[Feb 13 2020] Vishay Intertechnology has announced the introduction of A new IHDM edge-wound through hole inductor, the IHDM-1008BC-30, rated up to 150 A for industrial and defense applications. The Vishay Custom Magnetics IHDM-1008BC-30 adopts iron-powder core technology. It has excellent inductance and saturation stability, low power consumption and excellent heat dissipation in the harsh operating temperatu ...

2020-02 Passive Components Power Integrations

[Feb 12 2020] Power Integrations releases the CAPZero™-3 family of devices, the company's latest generation of sophisticated and energy-efficient X-capacitor discharge ics. The dual-terminal CAPZero-3 IC makes it easy for designers to meet our IEC60335 safety standard, and the new IC covers all capacitance values from 100 nF to 6 µF. IEC60335 is a discharge safety standard covering all appliances. In order to ...

2020-02 Semiconductors Renesas Electronics America

[Feb 12 2020] Renesas Electronics, Inc. announced the Renesas RX65N cloud Suite with onboard Wi-Fi, environmental, light intensity and inertial sensors for support of Amazon FreeRTOS and fast connectivity to Amazon Web Services (AWS). The suite helps embedded designers connect to AWS easily, quickly and securely. Using Renesas' integrated development Environment (IDE) "e2 studio", it is easy to create iot appl ...